Tin Whiskers Update Webinar at 10AM Central Time
2015-10-29 16:30 - 19:30 UTC
Latest Findings in Tin Whiskers in Electronics Webinar (FREE ATTENDANCE) Thursday, October 29 at 10AM US Central Time (Webex) Sponsored by the High Density Packaging Users Group www.hdpug.org The purpose of this Webinar is to share recent developments regarding tin whiskers, particularly with respect to the use of SAC solders. Topics to be covered include whisker growth mechanisms, real life failure histories, and whisker mitigation strategies. Top people in the field will give presentations and participate in a short Q&A session at the end of the webinar.
